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[THE INVESTOR] South Korean chipmaker SK hynix said in a conference call on Oct. 25 that it would increase the monthly output of 3-D NAND flash memory chips to around 20,000 to 30,000 sheets as previously planned in a bid to meet the fast-growing demand for it in the mobile sector.
The company said it would commercialize the third-generation 3-D NAND flash memory chip, which stacks 48 layers of cells inside, by the end of this year, while a fourth-generation NAND chip with 64 cell layers would be mass-produced in the latter half of next year.
By Kim Young-won (wone0102@heraldcorp.com)
The company said it would commercialize the third-generation 3-D NAND flash memory chip, which stacks 48 layers of cells inside, by the end of this year, while a fourth-generation NAND chip with 64 cell layers would be mass-produced in the latter half of next year.
By Kim Young-won (wone0102@heraldcorp.com)
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