Most Popular
-
1
Dongduk Women’s University halts coeducation talks
-
2
Russia sent 'anti-air' missiles to Pyongyang, Yoon's aide says
-
3
Defense ministry denies special treatment for BTS’ V amid phone use allegations
-
4
OpenAI in talks with Samsung to power AI features, report says
-
5
Two jailed for forcing disabled teens into prostitution
-
6
Disney+ offers sneak peek at 2025 lineup of Korean originals
-
7
South Korean military plans to launch new division for future warfare
-
8
Gold bars and cash bundles; authorities confiscate millions from tax dodgers
-
9
Teen smoking, drinking decline, while mental health, dietary habits worsen
-
10
Kia EV9 GT marks world debut at LA Motor Show
SK hynix Inc., the world's No. 2 chipmaker, said Thursday it has developed the world's first memory chip equipped with the Through Silicon Via (TSV) technology, significantly improving speed and efficiency.
The South Korean chipmaker said the high-bandwidth memory chip has a 128-gigabytes-per-second processing speed, which is four times faster than the GDDR5 chips, and can run on a relatively small power of 1.2 volts.
The latest product by SK hynix will also consume 40 percent less power, the company added.
Jointly developed with U.S.-based Advanced Micro Devices, the new product combines four 20 nanometer-class dynamic random access memory (DRAM) under the TSV technology, which allows the DRAMs to be connected with higher electrical efficiency.
SK hynix said the TSV-based chip can be applied to devices that require high graphic performance, and it can also be used in super computers and servers. It said the mass production of the cutting-edge chips will begin in the second half of 2014. (Yonhap News)
The South Korean chipmaker said the high-bandwidth memory chip has a 128-gigabytes-per-second processing speed, which is four times faster than the GDDR5 chips, and can run on a relatively small power of 1.2 volts.
The latest product by SK hynix will also consume 40 percent less power, the company added.
Jointly developed with U.S.-based Advanced Micro Devices, the new product combines four 20 nanometer-class dynamic random access memory (DRAM) under the TSV technology, which allows the DRAMs to be connected with higher electrical efficiency.
SK hynix said the TSV-based chip can be applied to devices that require high graphic performance, and it can also be used in super computers and servers. It said the mass production of the cutting-edge chips will begin in the second half of 2014. (Yonhap News)
